AUTSORSA is a fast-growing company founded and based in Bulgaria that serves clients from all over the world, providing business outsourcing, outstaffing and HR services.
Our client is a leading European semiconductor company developing cutting-edge AI chip infrastructure and high-performance computing platforms. Their engineering teams design advanced silicon solutions and packaging technologies that power next-generation AI processors.
If you are passionate about semiconductor implementation, advanced packaging technologies, and working on complex chiplet-based architectures, this is an excellent opportunity to join a highly innovative engineering environment.
We are looking for a Physical Design Engineer – RDL to contribute to the implementation of advanced chip packaging and redistribution layer designs for next-generation AI hardware platforms.
What you’ll do
* Develop and implement RDL (Redistribution Layer) physical designs for advanced semiconductor packaging solutions.
* Work on advanced packaging technologies, including chiplets and multi-die systems.
* Perform routing and layout implementation for high-performance interconnects within package structures.
* Optimize designs for signal integrity, power integrity, and manufacturability.
* Collaborate closely with silicon design, physical implementation, and packaging teams.
* Work with advanced EDA tools and methodologies to implement complex packaging solutions.
* Support verification and sign-off processes related to packaging and physical implementation.
* Contribute to the continuous improvement of physical design and packaging methodologies.
Requirements
* Bachelor’s, Master’s, or PhD in Electrical Engineering, Computer Engineering, or a related field.
* 5+ years of experience in Physical Design or advanced packaging implementation.
* Experience with RDL (Redistribution Layer) design or advanced semiconductor packaging.
* Strong knowledge of physical design methodologies and layout implementation.
* Experience with EDA tools used for physical design and packaging implementation.
* Understanding of signal integrity and power integrity considerations in advanced packaging.
* Strong analytical, debugging, and problem-solving skills.
* Excellent communication and teamwork abilities.
* English level C1 or higher.
Nice to have
* Experience with chiplet-based architectures.
* Knowledge of advanced packaging technologies and multi-die integration.
* Experience with high-performance computing or AI processor development.
* Experience with script-based automation (Python, TCL, Bash).
Why join us
* Relocation package for you and your family (visa, flight, first month rent, housing assistance).
* Permanent, full-time onsite role in Barcelona, Spain.
* Flexible working hours (9–6, Monday to Friday).
* Work in one of the very few companies in Europe building AI chip infrastructure.
* Small, highly skilled engineering team with opportunities for learning and growth.
* Supportive environment including relocation assistance for families.
* Candies, coffee, and free Spanish lessons included 🇪🇸
How to Apply
If you are passionate about advanced semiconductor packaging and physical design, we would love to hear from you.
Join us in building the next generation of AI-powered computing platforms.
By applying to this advertisement, you voluntarily provide your personal data and consent to their processing for the purposes of recruitment. The processing of your personal data is carried out in full compliance with the requirements of Regulation (EU) 2016/679 (General Data Protection Regulation), the Personal Data Protection Act, and all other applicable regulations.
License for the selection of personnel from the Employment Agency No. 3484 of 08.03.2023 and No. 3485 of 08.03.2023 for the EU.