As part of the PICs@ICFO Strategic Initiative, ICFO is currently coordinating the European Chips JU Pilot Line PIXEurope and the Catalan PhotonChip project—two flagship programs aimed at advancing Photonic Integrated Circuits (PICs) in Europe. As part of our expanding efforts, we are reinforcing our leadership in the full PIC value chain—including design, fabrication, advanced packaging, testing, and application development.
We are seeking up to two Process Engineers or Research Scientists with hands‑on experience in packaging and assembly of photonic integrated circuits (PICs). The selected candidates will play a key role in the experimental development of advanced PIC technologies within the PICs@ICFO strategic initiative. The position is hands‑on and lab‑oriented, suited for candidates with a solid technical background and a passion for practical work with integrated photonic devices.
Key Responsibilities
* Development and optimization of Photonic Packaging technologies (e.g. die bonding, wire bonding, optical coupling, hybrid integration) on semi‑automated assembly machines – including process programming and setup.
* Support on suppliers and material selection to ensure quality and process compatibility.
* Closely work with cross‑functional team (including PIC, optical, mechanical and RF designers) to implement manufacturable and scalable packaging processes.
* The candidate will be expected to collaborate closely with design, fabrication, and testing teams to ensure performance consistency across the development cycle.
This position will report to the Prof. Dr. Valerio Pruneri, Scientific Coordinator of the PICs@ICFO Strategic Initiative encompassing the European Chips JU Pilot Line PIXEurope and the Catalan PhotonChip project.
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