We are looking for a Senior Engineer with leadership capabilities to manage the mechanical development of complex ruggedized electronic systems (Control Units, Power, and Computing modules). The candidate will lead the engineering team in Spain, acting as the focal point for design decisions, and will coordinate technical integration with our international engineering teams.
Responsibilities
1. Team Leadership & Project Management
o Team Management: Lead, mentor, and prioritize tasks for the local engineering team (2 engineers).
o International Coordination: Act as the primary technical interface with the Thailand-based team (responsible for complementary subsystems) to ensure seamless mechanical and system integration.
o Stakeholder Management: Collaborate closely with the System Engineer and Project Manager to align design progress with project milestones.
o BOM Management: Manage and maintain the System BOM (Bill of Materials), ensuring accuracy and traceability.
o Requirements Analysis & Flow-down: Analyze customer specifications and System Requirements to define mechanical constraints (thermal, structural). Translate these high-level requirements into actionable tasks for the engineering team.
o Compliance Management: Maintain the Requirements Compliance Matrix (VCRM), ensuring every design decision (materials, coatings, fasteners) aligns with the technical specs and MIL-STD-810 standards.
2. Design & Development (SolidWorks)
o Rugged Packaging: Supervise the mechanical design of VPX 3U based systems, ensuring structural integrity and IP65 sealing (watertight/dust-tight) for harsh environments.
o Thermal Management: Lead the design of high-efficiency thermal solutions (conduction cooling) for high-power density electronics. This may include the use of heat pipes, heat spreaders, cold plates, etc.
o System Integration: Oversee the integration of the Backplane and the IO Panel (circular connectors), defining the interconnection strategy (cabling to payloads or rigid-flex PCB to backplane).
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