PbMain Tasks and responsibilities: /b /ppWe are seeking a Reliability Testing Engineer with a recently completed PhD and a strong background in thin-film reliability for implantable or bioelectronic systems, together with experience or familiarity in bonding rigid structures such as ASICs onto flexible polyimide-based thin-film devices. The candidate will contribute both to the development and optimization of bonding approaches for ASIC-integrated thin-film systems and to the design and execution of stability and reliability studies for packaged devices. You will combine hands-on experimental work with deep technical analysis, identify failure mechanisms across material, interface, bonding, and package levels, and collaborate with multidisciplinary teams to improve the robustness of next-generation neurotechnology. This is a highly attractive role for candidates who enjoy: /ppbr/pullibuilding and refining reliability and stability test strategies /li /ulpbr/pulliworking on thin-film systems that include bonding, packaging, and interconnect challenges /li /ulpbr/pulliunderstanding how failure emerges at interfaces rather than just within materials /li /ulpbr/pullicombining hands-on experiments with rigorous data analysis /li /ulpbr/pullitranslating test outcomes into better design, process, bonding, and packaging decisions /li /ulpbr/ppAs Reliability Engineer, you will help define how ASIC-integrated thin-film neurodevices are assembled and evaluated under demanding conditions that matter for real use. Main responsabilities of the position are: /ppbr/pulliDevelop test methodologies for evaluating packaged devices in physiologically relevant and in vivo-inspired conditions, with attention to moisture ingress, delamination, interface degradation, bonding integrity, interconnect failure, and encapsulation stability. /li /ulpbr/pulliDesign, develop, and optimize bonding approaches for rigid ASICs and related structures onto flexible polyimide-based thin-film devices, with attention to alignment, handling, interconnect integrity, and compatibility with downstream packaging and testing. /liliDesign and execute stability and reliability test plans for thin-film devices and packaged thin-film structures, including architectures integrated with or connected to ASIC-based systems. /li /ulpbr/pulliSupport RD efforts for ASIC-bonded thin-film structures to be assembled, handled, packaged, and tested in a repeatable and informative way. /li /ulpbr/pulliAnalyze failure mechanisms at the material, interface, bonding, package, and system level, and translate findings into clear engineering recommendations. /li /ulpbr/pulliSupport device assembly, bonding, and laboratory activities where needed, including handling of fragile structures and reliability test setups. /li /ulpbr/pulliProduce high-quality technical reports, maintain strong documentation and traceability, and communicate results clearly in cross-functional reviews. /li /ulpbr/pulliHelp shape the long-term reliability strategy for next-generation implantable thin-film neurotechnology. /li /ulpbr/ppbRequirements: /b /ppbr/pullibEducation: /b /li /ulpPhD recently completed in Materials Science, Biomedical Engineering, Electrical Engineering, Micro/Nanotechnology, Microsystems, Bioelectronics, Neural Engineering, or a related discipline. /ppYou will likely be especially strong in this role if your PhD involved some combination of: /ppbr/ppimplantable thin-film devices /ppbr/ppchronic or accelerated reliability testing /ppbr/ppin vivo or explant-adjacent validation /ppbr/ppencapsulation / hermeticity / barrier-layer strategies /ppbr/ppchip-to-thin-film integration and rigid-to-flex bonding /ppbr/ppfailure analysis of flexible bioelectronic systems /ppbr/pptest platforms for packaged microsystems in saline or physiological environments /ppbr/pullibKnowledge and Professional Experience: /b /li /ulpStrong research background in thin-film reliability, especially where devices were tested under wet, physiological, chronic, in vivo, or implantation-relevant conditions. /ppbr/ppExperience with advanced packaging or encapsulation approaches for thin-film devices, especially where packaging enabled reliable operation and testing of bonded or hybridized structures. /ppbr/ppExperience with bonding, or strong familiarity with bonding, rigid structures such as ASICs onto flexible polyimide-based thin-film devices, including process integration, alignment, handling, and interface-related challenges. /ppbr/ppDemonstrated experience designing experiments for investigating failure mechanisms, extracting meaningful reliability metrics, and converting raw test data into engineering conclusions. /ppbr/ppbr/pullibPersonal Competences: /b /li /ulpClear technical communicator with strong ownership, autonomy, and a practical problem-solving mindset. /ppComfortable moving between hands-on lab work and structured technical analysis. /p pbr/ppbSummary of conditions: /b /pulliFull time work (37,5h/week) /liliContract Length: Temporary (1 year) /liliLocation: Bellaterra (Barcelona) /liliSalary will depend on qualifications and demonstrated experience. /liliSupport to the relocation issues. /liliLife Insurance. /li /ulpEstimated Incorporation date: as soon as possible. /p