**Key Responsibilities**:
- Provide hands-on technical expertise in the design, micro-nanofabrication of interposer substrates for both electronic and photonic packaging.
- Train, supervise, and coordinate the work of technicians and junior engineers within the group.
- Lead the procurement, installation, and operational management of specialized equipment and infrastructure related to interposer and packaging.
This position will be dedicated full time to the **European Chips JU Pilot Line project PIXEurope** directed by **Prof. Dr. Valerio Pruneri**.
This contract has received funding from the European Union’s Horizon Europe under the Grant Agreement # 101213744, Chips Joint Undertaking (Chips JU) and the Spanish Ministry for Digital Transformation and Civil Service, and is supported by funds from the Recovery, Transformation and Resilience Plan (PRTR).
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Applicants must hold, at the time of appointment, an internationally recognized engineering degree or PhD-equivalent (or be on track to complete it shortly), preferably in Science or Engineering disciplines.
- Practical, hands-on experience in design, micro-nanofabrication and characterization of substrates with electrical and optical functionalities.
- Expertise in equipment procurement, setup, and operational workflows.
- Direct involvement in applied and/or industry-oriented research and product development.
- Leadership in research, development, and engineering projects involving multiple stakeholders.
**What We Offer**
- Indefinite contract for scientific and technical activities pursuant to Spanish Law 14/2011, linked to the duration or availability of funds within the PIXEurope Pilot Line
- Access to cutting-edge facilities and a vibrant, interdisciplinary research environment.
- A presentation letter outlining your interest in the position.
- A curriculum vitae, including full contact information.
Applications will be reviewed as they are received.
21st of July, 2025